Accurate Simulation of Mechanical Stresses in Silicon During Thermal Oxidation
نویسنده
چکیده
The aim of this paper is to present viscoelastic models to accurately simulate mechanical stresses which result from volume expansion during thermal oxidation or temperature ramps in silicon technology. Comparisons are made with wafer curvature measurements and it is shown that mechanical stresses can explain the "anomalously" fast initial regime during dry oxidation, without involving any additional chemical mechanism.
منابع مشابه
On 2D/3D Numerical Oxidation Modeling: Calibration and Investigation of Silicon Crystal Orientation Effect on Stresses in Shallow Trench Isolations
Shallow trench isolations (STI) process needs careful optimization of thermal annealings in order to minimize leakage currents which may result from excessive mechanical stresses. Due to its intrinsic three-dimensional structure, conventional 2D process simulator is no more relevant. This paper examines stress generation in STI using for the first time a 3D fully non-linear viscoelastic oxidati...
متن کاملEvaluation of Thermo-mechanical stress in work rolls of ring rolling mill under thermal and mechanical loading
The defect in work rolls directly influence the forming cost and the final shape of the product. The researchers tend to investigate the thermo-mechanical stress in work roll of rolling machines. These stresses may reduce the roll life. Since the investigation of the thermo-mechanical stress in work roll with real-conditions is complex, comprehensive studies by means of numerical methods are av...
متن کاملUnderstanding of the Retarded Oxidation Effects in Silicon Nanostructures
In-depth understanding of the retarded oxidation phenomenon observed during the oxidation of silicon nanostructures is proposed. The wet thermal oxidation of various silicon nanostructures such as nanobeams, concave/convex nanorings, and nanowires exhibits an extremely different and complex behavior. Such effects have been investigated by the modeling of the mechanical stress generated during t...
متن کاملOptimization of thermal curing cycle for a large epoxy model
Heat generation in an exothermic reaction during the curing process and low thermal conductivity of the epoxy resin produces high peak temperature and temperature gradients which result in internal and residual stresses, especially in large epoxy samples. In this paper, an optimization algorithm was developed and applied to predict the thermal cure cycle to minimize the temperature peak and the...
متن کاملOn the Determination of Thermal Expansion Coefficient of Thermal Oxide
The accurate value of thermal expansion coefficient ( ) of thin film is an important thermal property in the design of microelectronic devices and microsystem. This research presents a microbridge buckling deformation caused by the residual stresses to determine the of thermal oxide (SiO2) film. The extraction of is supported through experimental means and finite element analysis (FEM) of the b...
متن کامل